发明名称 ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To enable to secure a mounting space of a conductive material connecting an electrode of a first substrate and an outer terminal of a second substrate without changing the size of a package but by changing the shape of a spacer between the both substrates, in an electronic device such as an electron tube for putting outer terminals connected to electrodes of a first substrate and a second substrate facing each other together into the second substrate. SOLUTION: Fig. 2 shows an example of putting outer terminals 421 of a filament electrode 41 of a front substrate 31 together to an anode substrate 32. Corner parts of the spacer (a side-face member) 33 have protruded parts 33C formed protruded inward. The filament electrode 41 and the outer terminals 421 are connected by the conductive material 51. The conductive material 51 is mounted on a space created by the protruded parts 33C. The spacer 33 is formed by applying paste with the use of a dispenser. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008016200(A) 申请公布日期 2008.01.24
申请号 JP20060182894 申请日期 2006.07.02
申请人 FUTABA CORP 发明人 YONEZAWA SADAHISA;KAWASAKI HIROAKI;KOMATA KENICHI
分类号 H01J29/86;H01J31/15 主分类号 H01J29/86
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