| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide polishing system and method for efficiently and uniformly polishing a surface of a tape-like metallic substrate of a several hundred meter unit at high speed. <P>SOLUTION: This polishing system for continuously polishing the surface to be polished of the tape-like metallic substrate is constituted of a device for continuously traveling the tape-like metallic substrate, a device for applying prescribed tension to the tape-like metallic substrate, a first polishing device for performing initial polishing for the surface to be polished at random, and a second polishing device for performing final polishing for the surface to be polished along a traveling direction. By the final polishing, polished marks along the traveling direction are formed on the surface to be polished. <P>COPYRIGHT: (C)2008,JPO&INPIT |
