| 摘要 |
An IC socket, an IC socket assembly, and a manufacturing method for the IC socket are provided to enable all contact portions to be formed in a lump by resin molding, thereby solving a problem that the production time increases as the number of IC socket pins increases. An IC(Integrated Circuit) socket(1) comprises a plate-type socket base body(10) and a plated layer(20). The plate-type socket base body includes a through hole forming portion(12). The through hole forming portion has a plurality of contact housing holes and through holes(11,13). The plurality of contact housing holes is formed to penetrate the plate-like socket base in a front-to-back direction. The through holes are formed around each of the contact housing holes so as to penetrate the plate-type socket base in the front-to-back direction. A plate-type contact portion(14) has a base portion integrally formed on a side wall on a front side of the through hole forming portion and is formed in a state of facing the through holes. The plated layer is continuously formed on the inner wall of the through hole, on the front and back sides of the through hole forming portion, and on a surface of the contact portion.
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