Wafer level package for surface acoustic wave device and fabrication method thereof

摘要

A wafer level package for a surface acoustic wave device (100) and a fabrication method thereof include a SAW device (110) formed with a SAW element (112) on an upper surface of a device wafer (111); a cap wafer (120) joined on an upper part of the SAW element; a cavity part (130) housing the SAW element between the cap wafer and the SAW device; a cap pad (121) formed on an upper surface of the cap wafer; and a metal line (122) formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.