Method of manufacturing a semi-conductor wafer comprising an integrated optical filter

摘要

The method involves collectively implanting components i.e. complementary MOS imagers (10), on a front surface of a wafer (15`) of a semiconductor, where the imagers capture images. Polymers layers (31-33) e.g. adhesive layer, forming an optical filter is deposited on the front surface of the wafer by spin coating. A plate of a transparent material i.e. glass plate (20`), is fixed on the front surface of the wafer. An independent claim is also included for an imager comprising a chip of a transparent material.