| 摘要 |
<p>An apparatus (100) having a heating circuit (150) including a resistor layer (124) and a patterned conductor layer (126) is disclosed. The pattern (126) defines a current path (150) that includes at least one portion of the resistor layer (124). When current is applied to the current path (150), heat is generated in the portion of the resistor layer (124) that is a part of the current path (150). The heat is used to reflow solder to connect two components such as an integrated circuit chip (IC) (106) to a multi-chip module (MCM) module (102). This localized electric heating method may be used to package multiple chips (104, 106) on a module (102). The apparatus (100) having the heating circuit (150) may be fabricated by first depositing a resistor layer (124) on to a substrate (120). Then, a conductor layer (126) is deposited and etched to define the current path (150). <IMAGE></p> |
