首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
净水器
摘要
申请公布号
CN300736455D
申请公布日期
2008.01.23
申请号
CN200730138410.3
申请日期
2007.02.16
申请人
林俊钰
发明人
林俊钰
分类号
23-01
主分类号
23-01
代理机构
福州智理专利代理有限公司
代理人
丁秀丽
主权项
地址
200031上海市余姚路569号205室
您可能感兴趣的专利
Kinase inhibitors and method of treating cancer with same
Combretastatin analogs for use in the treatment of cancer
Angiogenesis inhibitors
Antiviral compounds of three linked aryl moieties to treat diseases such as hepatitis C
Amorphous (5-fluoro-2-methyl-3-quinolin-2-ylmethyl-indol-1-yl)-acetic acid
Benzenesulfonamide compounds, method for synthesizing same, and use thereof in medicine as well as in cosmetics
Crystalline forms of certain 3-phenyl-pyrazole derivatives as modulators of the 5-HT<sub>2A </sub>serotonin receptor useful for the treatment of disorders related thereto
2-aryl imidazo[1,2-a]pyridine-3-acetamide derivatives, preparation methods and uses thereof
Contraceptive peptides derived from the venom of the spider <i>Latrodectus mirabilis</i>, nucleotide sequences to transform a microorganism to produce said peptides; methods to obtain the peptides; pharmaceutical compositions containing thereof and use thereof
Peptide compounds exhibiting glucagon antagonist and GLP-1 agonist activity
Lubricant compositions with improved oxidation stability and service life
Thermal recording material and method for producing the same
Catalyst for converting nitrogen oxide into ammonia and method for manufacturing the same
Method of regenerating NO<sub>x </sub>removal catalyst
Methods for single exposure—self-aligned double, triple, and quadruple patterning
Method of pattern formation
Substrate polishing method, semiconductor device and fabrication method therefor
Adhesion layer for through silicon via metallization
Barrier layer conformality in copper interconnects
Semiconductor device and manufacturing method thereof