STACK TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A stack type semiconductor package and a method for fabricating the same are provided to obtain reliable connection between stacked unit packages by inserting an internal connection solder ball of an upper unit package into a via hole of a protective layer of a lower unit package. A semiconductor chip(150) is arranged on a substrate(100). A bump(120) is arranged on an upper surface of the substrate. A lower unit package includes a protective layer(170) which is formed to cover a protective layer(170). The protective layer includes a via hole(170a) for exposing a part of the bump. An upper unit package is arranged on the protective layer. An internal connection solder ball(190_2) is formed on the lower surface of the upper unit package. The internal connection solder ball is inserted into the via hole to be connected to the bump.