发明名称 RESIN COMPOSITION FOR ADHESIVE SHEET AND ADHESIVE SHEET USING THE COMPOSITION FOR FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A resin composition for an adhesive sheet is provided to realize excellent shelf life at room temperature, soldering resistance and heat resistance after curing, flexibility and high adhesion maintenance. A resin composition for an adhesive sheet comprises: an acrylic copolymer comprising (A) an acrylate, methacrylate or a mixture thereof, (B) an acrylonitrile, methacrylonitrile or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent contains at least one compound selected from the group consisting of Lewis acid amine complexes. The Lewis acid amine complex and component (C) are used in an amount of 0.05-0.8 parts by weight and 1-6 parts by weight, respectively, based on 100 parts by weight of the acrylic copolymer.
申请公布号 KR20080008242(A) 申请公布日期 2008.01.23
申请号 KR20070070695 申请日期 2007.07.13
申请人 ARISAWA MFG. CO., LTD. 发明人 HASEGAWA SHINICHI;HIGUCHI FUMIKI;UEKI TORU
分类号 C08L33/08;C08L31/00;C08L33/10;C08L33/20 主分类号 C08L33/08
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