| 发明名称 |
Wiring substrate and electronic parts packaging structure |
| 摘要 |
<p>The via holes (14a,14b,14d) formed in an interlayer insulating film (14) have a via post (11) which acts as struts for supporting connection pad (P) to withstand pressure of ultrasonic vibration applied during ultrasonic flip-chip packaging. An independent claim is also included for electronic components packaging structure.</p> |
| 申请公布号 |
EP1471574(B1) |
申请公布日期 |
2008.01.23 |
| 申请号 |
EP20040252265 |
申请日期 |
2004.04.16 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA, KEI;SUNOHARA, MASAHIRO |
| 分类号 |
H01L23/12;H01L23/498;H01L21/60;H01L23/00;H01L23/485;H01L23/522;H01L23/538;H05K1/02;H05K1/11;H05K3/32 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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