| 摘要 |
<p>A dual base plate heatsink (10) for use in dissipating heat for electronic devices has sufficient thermal contact between fins and the base plates and is manufactured without the requirement for welding. Separately extruded fins (22) are connected to both base plates (12) by placing the fins side by side in channels (16) in both base plates. In order to couple the base plates (12) and the fins (22), the base plates are maintained at a constant relative distance and a swaging tool (40) is passed adjacent the fins (22) and between the base plates (12) in a direction parallel to the surface of the base plates (12). The swaging tool (40) asserts pressure to the base plates (12) to thereby swage the base plates (12) against the ends (24) of the fins (22). Undesirable warping of the base plates (12) during the process is reduced or prevented by providing a base plate configuration that minimizes the bending moment between the swaged base plate material and the rest of the base plate (12).
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