Polishing slurry and polishing method

摘要

A polishing slurry comprising an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5, wherein:
the metal inhibitor contains one or more types selected from the group (C-group) consisting of aromatic compounds having a triazole skeleton and one or more types selected from the group (D-group) consisting of aliphatic compounds having a triazole skeleton, compounds having a pyrimidine skeleton, compounds having an imidazole skeleton, compounds having a guanidine skeleton, compounds having a thiazole skeleton and compounds having a pyrazole skeleton.