发明名称 Electronic component for heat transfer by boiling and condensation, and manufacturing method
摘要 <p>The component has nanowires (13) with free ends used as heat exchange surfaces immersed in a heat transfer fluid (11) and formed on a base substrate (14). An electrically insulating and less thermal conducting coating material (12) partially coats the nanowires arranged between the substrate and the fluid, where the material is polymer or parylene coating. Each nanowire forms a thermocouple constituted of two coaxial branches in different materials, where the branches are separated by an electrically insulating layer (16) and electrically and individually connected at the nanowire free ends. An independent claim is also included for a method for manufacturing an electronic component.</p>
申请公布号 EP1881538(A1) 申请公布日期 2008.01.23
申请号 EP20070354044 申请日期 2007.07.10
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 GRUSS, JEAN-ANTOINE;PLISSONNIER, MARC
分类号 H01L35/30;H01L23/427 主分类号 H01L35/30
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