| 摘要 |
A polishing head of a chemical mechanical polishing device is provided to shorten time taken for assembly or dis-assembly and reduce defects. A polishing head(100) includes an elastic retainer ring(120), a head body unit(110), and a joint member(130). The retainer ring is formed into a ring shape which surrounds edges of a wafer, and has an upper surface on which a plurality of holes(120a) with embossing are formed at a constant interval. The head body unit has a bottom surface on which the wafer is attached, and an edge along which through holes are formed to be mated to the holes of the retainer ring. The joint member passes through the holes of the head body unit and is fitted into holes of the retainer ring. The joint member has an outer surface to be engaged with the embossing of the holes of the retainer ring. |
