METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a printed circuit board is provided to minimize the bending of the printed circuit board by leaving a dummy metal frame in a completed product. A method for manufacturing a printed circuit board(200) includes the steps of: (a) providing a work substrate(100) on which a metal plate having a rigidity of 100GPa or higher to both surfaces of a resin substrate(101); (b) exposing the resin substrate of a product part(103) and forming a dummy metal frame surrounding an outer circumference portion of the product part; (c) forming a through-hole by the resin substrate of the product part; (d) forming an inside layer circuit pattern on the resin substrate of the product part in which the through-hole is formed; (e) laminating an insulating layer on the product part in which the inside layer circuit pattern is formed; (f) forming a via-hole by processing a via-hole; (g) forming an outside layer circuit pattern on the insulating layer in which the via-hole is formed; and (h) exposing a circuit pattern of a part serving as a bump pad for mounting a semiconductor and a soldering pad for coupling with an external component.