发明名称 |
Method of producing a chip-type solid electrolytic capacitor |
摘要 |
A chip-type solid electrolytic capacitor comprises capacitor elements. A cathode terminal comprising a plate-like conductor is interposed between cathode layers of the capacitor elements. The capacitor elements are bonded to each other by a bonding agent such as a solder or a conductive adhesive. The cathode terminal is provided with a through hole formed at a portion to be brought into contact with each of the capacitor elements. Bonding surfaces of the capacitor elements are directly connected at the through hole.
|
申请公布号 |
US7320924(B2) |
申请公布日期 |
2008.01.22 |
申请号 |
US20060523417 |
申请日期 |
2006.09.19 |
申请人 |
NEC TOKIN CORPORATION;NEC TOKIN TOYAMA, LTD. |
发明人 |
KIDA FUMIO;NAKANO MAKOTO |
分类号 |
H01G9/14;H01L21/20;H01G4/00;H01G4/228;H01G9/00;H01G9/008;H01G9/012 |
主分类号 |
H01G9/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|