发明名称 |
BONDING AN ADHERENT TO A SUBSTRATE VIA A PRIMER |
摘要 |
<p>A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.</p> |
申请公布号 |
KR20080007587(A) |
申请公布日期 |
2008.01.22 |
申请号 |
KR20077026265 |
申请日期 |
2006.05.10 |
申请人 |
DOW CORNING IRELAND LIMITED |
发明人 |
LEADLEY STUART;SHEPHARD NICK;O'NEILL LIAM;GUBBELS FREDERIC |
分类号 |
C23C16/02;B05D7/24;C09J5/02 |
主分类号 |
C23C16/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|