发明名称 Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
摘要 A semiconductor device includes a protrusion group composed of a plurality of first protrusions arranged on a mounting surface with predetermined gaps; a plurality of second protrusions for burying spaces between the neighboring first protrusions; and conductive members provided on protruding surfaces of the plurality of first protrusions.
申请公布号 US7321169(B2) 申请公布日期 2008.01.22
申请号 US20050232381 申请日期 2005.09.21
申请人 SEIKO EPSON CORPORATION 发明人 IMASEKI RYOSUKE;KANEKO KEN
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
代理机构 代理人
主权项
地址