发明名称 Trench capacitors with buried isolation layer formed by an oxidation process and methods for manufacturing the same
摘要 A method for forming a trench capacitor includes: removing a portion of the substrate to form a trench within the substrate; forming at a buried isolation layer within the substrate; forming in the substrate a first electrode of the trench capacitor at least in areas surrounding a lower portion of the trench; forming a dielectric layer of the trench capacitor; and forming a second electrode of the trench capacitor in the trench. The buried isolation layer intersects with the trench and has one or more gaps for providing body contact between a first substrate area above the buried isolation layer and a second substrate area below the buried isolation layer.
申请公布号 US7320912(B2) 申请公布日期 2008.01.22
申请号 US20050125676 申请日期 2005.05.10
申请人 PROMOS TECHNOLOGIES INC. 发明人 LEE YUEH-CHUAN;TUNG MING-SHENG
分类号 H01L21/8242 主分类号 H01L21/8242
代理机构 代理人
主权项
地址