发明名称 |
Linear split axis wire bonder |
摘要 |
A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis. |
申请公布号 |
US7320424(B2) |
申请公布日期 |
2008.01.22 |
申请号 |
US20050092399 |
申请日期 |
2005.03.29 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
BEATSON DAVID T.;FRASCH E. WALTER |
分类号 |
B23K37/00;B23K20/00;B23K31/00;B23K31/02;H01L21/60 |
主分类号 |
B23K37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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