发明名称 POLYMER RESIN MOLDING DEVICE FOR RAPID HEATING AND RAPID COOLING AND MOLDING METHOD USING THEREOF
摘要 <p>A polymer resin molding device for rapid heating and rapid cooling and a molding method using the same are provided to improve fluidity of resin in the molding device and easily transfer pressure in the molding device. A polymer resin molding device includes a molding unit(100), a hot water supply unit(200), a cold water supply unit(300), a purge unit(400), and a control unit(500). The molding unit includes a temperature sensor and a fluid passage. The hot water supply unit includes a storage unit(210) for storing hot fluid, a heater tank(250) for heating and supplying hot fluid, and a recovery tank(230) for recovering hot fluid passed through the molding unit. The cold water supply unit includes a heat exchanger(320) for exchanging heat with water prior to the recovery of cold fluid passed through the molding unit into a cold fluid storing unit(310). The purge unit includes a compressed air supply unit(420) for supplying compressed air for discharging residual fluid and an auxiliary tank(410) for storing the discharged residual fluid. The control unit controls the hot water supply unit, the cold water supply unit and the purge unit.</p>
申请公布号 KR100794763(B1) 申请公布日期 2008.01.21
申请号 KR20070011857 申请日期 2007.02.05
申请人 AHN, YOUNG WOO;HUH, WON GOU 发明人 OH, KWAN SIK;PARK, SUN KEUN;AHN, HEUNG KYU;HUH, WON GOU;AHN, YOUNG WOO
分类号 B29C45/72;B29C45/76;B29C45/78 主分类号 B29C45/72
代理机构 代理人
主权项
地址