| 摘要 |
<p>A solution treatment method and a solution treatment unit are provided to maintain a temperature distribution of a surface of substrate uniformly by preventing impurities from being adhered to a substrate. A solution treatment method includes the steps of: supplying a gas from an upper part of a vessel inside a casing; adjusting a first flow rate of the supplied gas flowing into the vessel and a second flow rate of the supplied gas flowing out of the vessel; and exhausting the gas flown into the vessel and the gas flown out of the vessel outside the casing, wherein the solution treatment is a developing process. The first flow rate is adjusted to be smaller than the second flow rate during a substrate process by supplying a treating solution onto the substrate.</p> |
