| 摘要 |
PROBLEM TO BE SOLVED: To reduce stresses applied to an object to be heated by reducing temperature variation thereof by giving distributed light-irradiation intensity in a temperature raising step (an open-circuit control step) after starting the light irradiation. SOLUTION: A method for heat treatment by light irradiation comprises a step for supporting the object 103 to be heated in a vessel and heat-treating the object 103 to be heated by a plurality of light-irradiation heating means 101 provided with a planar configuration and facing a surface of the object to be heated 103. In the step of raising the temperature of the object 103 to be heated by light irradiation from the light-irradiation heating means 101, the object 103 to be heated is irradiated with a light having such a planar light-intensity distribution as to make the maximum temperature difference within the surface of the object to be heated 70°C or lower. As a consequence, the temperature variation within the object 103 to be heated can be reduced in the open-circuit control step after the start of the light irradiation. Thereby, the stresses can be reduced; strains, deformations, bows, cracks and the like can be eliminated; characteristics fluctuations of the semiconductor devices formed in the object 103 to be heated can be suppressed; and reliability failures can be reduced. COPYRIGHT: (C)2008,JPO&INPIT
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