发明名称 Semiconductor manufacturing method and semiconductor laser device manufacturing method
摘要 There are provided preflow periods t 11 , t 12 in which group III element materials TMG, TMA and TMI are not supplied from a group III element material container to a reaction region (reactor), while a group V element material PH<SUB>3 </SUB>and an Mg dopant material are supplied from a group V element material container and a dopant material container to the reaction region (reactor) after an Mg-undoped group III-V compound semiconductor layer is crystallinically grown and before an Mg-doped group III-V compound semiconductor layer is crystallinically grown. According to the semiconductor manufacturing method, an Mg doping profile can be accurately controlled.
申请公布号 US2008014671(A1) 申请公布日期 2008.01.17
申请号 US20070822604 申请日期 2007.07.09
申请人 SHARP KABUSHIKI KAISHA 发明人 YAMAMOTO KEI;NAKAMURA JUNICHI
分类号 H01L21/02 主分类号 H01L21/02
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