发明名称 |
System for supplying molding compounds |
摘要 |
A system for supplying molding compounds comprising: a barrel, having a plurality of storage holes for storing a plurality of molding compounds; a first push rod below the barrel pushing the plurality of molding compounds within the storage holes; a holder above the barrel holding the molding compounds pushed by the first push rod; a carrier having a plurality of placing holes for the holder putting the plurality of molding compounds, wherein the holder moves to a predetermined position after putting the molding compounds; and a second push rod below the predetermined position pushing the molding compounds located in the placing holes, and then the holder holding the molding compounds and transporting to a mold.
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申请公布号 |
US2008014297(A1) |
申请公布日期 |
2008.01.17 |
申请号 |
US20060645696 |
申请日期 |
2006.12.27 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHANG YUN-LUNG;TSAI YU-CHANG;SUN MING-WEI |
分类号 |
B29C71/00 |
主分类号 |
B29C71/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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