发明名称 System for supplying molding compounds
摘要 A system for supplying molding compounds comprising: a barrel, having a plurality of storage holes for storing a plurality of molding compounds; a first push rod below the barrel pushing the plurality of molding compounds within the storage holes; a holder above the barrel holding the molding compounds pushed by the first push rod; a carrier having a plurality of placing holes for the holder putting the plurality of molding compounds, wherein the holder moves to a predetermined position after putting the molding compounds; and a second push rod below the predetermined position pushing the molding compounds located in the placing holes, and then the holder holding the molding compounds and transporting to a mold.
申请公布号 US2008014297(A1) 申请公布日期 2008.01.17
申请号 US20060645696 申请日期 2006.12.27
申请人 ADVANCED SEMICONDUCTOR ENGINEERING, INC. 发明人 CHANG YUN-LUNG;TSAI YU-CHANG;SUN MING-WEI
分类号 B29C71/00 主分类号 B29C71/00
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