Halbleiterchip-Stapelpackung und Leiterrahmen hierfür

摘要

The package has a frame with lead groups (50, 60) to interface semiconductor chips, with common and independent electrode pads (32, 42), to an external device. The lead group consists of both common and independent leads to route address, control and data signals, respectively. A common lead selected from each group is interconnected to route a shared signal and similarly an independent lead to route separate signals.