发明名称 RESIST PROTECTIVE FILM MATERIAL AND METHOD FOR FORMING PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist protective film material that reliably gives a resist pattern having a preferable rectangle even when a protective film is formed on a photoresist film, and to provide a method for forming a pattern using the above material. <P>SOLUTION: The resist protective film material contains at least a high molecular compound expressed by general formula (1) having an amino group or a sulfonamide group at a polymerization end. The method for forming a pattern includes at least steps of: forming a photoresist film on a substrate; forming a resist protective film on the photoresist film by using the above resist protective film material; exposing; and developing by use of a developer solution. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008008985(A) 申请公布日期 2008.01.17
申请号 JP20060176947 申请日期 2006.06.27
申请人 SHIN ETSU CHEM CO LTD 发明人 HARADA YUJI;HATAKEYAMA JUN
分类号 G03F7/11;H01L21/027 主分类号 G03F7/11
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