| 摘要 |
PROBLEM TO BE SOLVED: To provide the method of manufacturing a circuit board capable of improving the accuracy of alignment relative to the opening of a metal plate. SOLUTION: A metal plate 1 having an opening 2 is provided on a circuit board as a core member. A projection 3a is provided at the end of the upper surface side (the front surface side) of the opening 2. Wiring patterns 7 and 8 are formed on both surface sides of the metal plate 1 via insulating layers 4 and 5. Moreover, a conductor 9 for connecting the wiring patterns 7 and 8 is provided so that the conductor penetrates through the metal plate 1 via a through hole 6 provided in the opening 2, in order to electrically connect the wiring patterns. Further, an LSI chip 10 is directly connected with the upper surface side of the circuit board via a solder ball 11. Here, the front surface of the insulating layer 4 provided on the upper surface side of the metal plate 1 is uniformly planarized without depending on the existence and nonexistence of the opening 2 of the metal plate 1. In a planarized portion near which there is no opening 2, the film thickness of the insulating layer 4 is T1. At the end of the opening having the projection 3a, the film thickness of the insulating layer 4 is formed as T2 thinner than the film thickness T1. COPYRIGHT: (C)2008,JPO&INPIT
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