发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of improving the reliability of the connection between the internal electrode such as a leader electrode and the external electrode, thereby being capable of relaxing the barrel polishing condition. SOLUTION: The manufacturing method of the electronic component comprises the steps of forming an unbaked leader electrode 112A on an unbaked insulating layer 111A formed on a carrier film 100; forming a curing resin layer 120A whose ends are arranged on the unbaked leader electrodes 112A and 112B, and on the sides of the parts connected to external electrodes 13A and 13B; forming an unbaked lamination 111 by alternately laminating the unbaked insulating layer 111A, an unbaked conductor pattern 112C, and a through-hole conductor 112D on the unbaked leader electrodes 112A, 112 and the curing resin layer 120A; and forming voids 15'A and 15'B by baking the lamination 111 to burn and eliminate the curing resin layer 120A. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008010674(A) 申请公布日期 2008.01.17
申请号 JP20060180310 申请日期 2006.06.29
申请人 MURATA MFG CO LTD 发明人 YAMANO KAZUHIKO
分类号 H01F41/04;H01F17/00;H01F27/29 主分类号 H01F41/04
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