| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure of a chip built-in substrate for effectively positioning the semiconductor chip to a chip carrier. SOLUTION: The package structure of the chip built-in substrate comprises a carrier plate having a step-like opening, the semiconductor chip (or the chip set) housed in the opening of the carrier plate; a dielectric layer formed to the semiconductor chip and the carrier plate, filled in a gap between the semiconductor chip and the opening of the carrier plate, and fixing the semiconductor chip to the carrier plate; and a circuit layer formed in the dielectric layer. The circuit layer is electrically connected to electrode pads of the semiconductor chip by a plurality of conductive structures, in the result, the semiconductor chip is electrically connected outside. COPYRIGHT: (C)2008,JPO&INPIT
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