| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe assembly not generating large displacement of an inspection object in the lateral direction, and not damaging a device domain, in electric inspection of the inspection object such as a semiconductor wafer having an asymmetric array pattern. SOLUTION: The probe assembly has a plurality of probes fixed to anchor parts of a probe substrate, elongated in the separation direction from the anchor parts via fulcrums, and having a needle tip on the tip respectively, whose each tip side part can be deformed elastically when each needle tip is pressed. The probes constitute a first probe group wherein the direction from the fulcrum to the needle tip is faced toward one direction, and a second probe group faced to the reverse direction to the probe direction of the group. Either of both probe groups includes a dummy probe whose needle tip does not abut on an electrode, and the needle tip of the dummy probe is arranged in a domain corresponding to a non-device domain of a semiconductor device. COPYRIGHT: (C)2008,JPO&INPIT
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