| 摘要 |
A sputtering chamber to coat a substrate (15) includes at least two sputt ering targets (102,103), one of the at least two targets disposed on a first side a substrate conveyor extending within the chamber, and another of the at least two targets disposed on a second side of the conveyor. The at least two targets may be independently operable, and at least one of the targets, if inactivated, may be protected by a shielding apparatus. Both of the at l east two targets may be mounted to a first wall of a plurality of walls encl osing the sputtering chamber. |
