发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition from the moldings of which the emission of the residual crosslinking agent is controlled at no expense of the appearance of the moldings. SOLUTION: The thermosetting resin composition includes a thermosetting resin component, a crosslinking agent and an absorbent absorbing the crosslinking agent. Preferably, the absorbent is composed of an inorganic material having pores. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008007568(A) 申请公布日期 2008.01.17
申请号 JP20060177298 申请日期 2006.06.27
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 INOUE TAKAHIRO;TSUTSUI TOSHINAO;TAGAWA KIYOMI
分类号 C08F283/01;C08F290/00 主分类号 C08F283/01
代理机构 代理人
主权项
地址