| 摘要 |
PROBLEM TO BE SOLVED: To obtain simplification of an alignment monitoring system and highly uniform bonding without bonding unevenness in a bonding apparatus for substrate samples by anodic bonding or pressure bonding. SOLUTION: A gate valve is provided in the upper opening of an alignment chamber. A "peephole" is provided at the top of the gate valve and a bonding head is held in a bonding chamber, thereby capable of simplifying the constitution of the monitoring system. A "temporal tacking mechanism" is provided in part of the alignment mechanism to suppress the displacement of two substrate samples. In addition, a plasma cleaning mechanism is provided in the alignment chamber to allow consistent treatment of the steps of plasma cleaning, alignment, and bonding in vacuum or a desired gas atmosphere. Further, a contact electrode at the time of anode bonding is divided into plural numbers, thereby allowing independent control of the timing of high voltage application for every divided bonding region to improve uniformity of bonding. COPYRIGHT: (C)2008,JPO&INPIT
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