| 摘要 |
PROBLEM TO BE SOLVED: To reduce the level of crosstalk and EMI, to provide an efficient thermal coupling between the DAS and the sensor array, and to increase the reliability. SOLUTION: An interface circuit for a sensor array (20) of a CT detector may be made up of an integrated circuit package (104) that provides a first region (106) and a second region (108). The first region may be spaced apart and opposite to the second region of the package. The first region (106) of the package provides a plurality of interfaces for interconnecting to an integrated circuit (102) in the package with a plurality of signals from the sensor array having a first electrical characteristic, such as analog and test signals. The second region (108) of the package provides a plurality of interfaces for interconnecting to the integrated circuit with a plurality of signals having an electrical characteristic different from the first characteristic, such as power and operational digital signals. COPYRIGHT: (C)2008,JPO&INPIT
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