发明名称 Nondestructive Inspection Method For Inspecting Junction Of Flexible Printed Circuit Board
摘要 It is an object of the present invention to provide a nondestructive inspection method which does not use X-ray or gamma radiation that may exert adverse effect on human body and which is capable of easily and reliably detecting inconvenient defects in junction. An apparatus comprises a stage capable of supporting the test specimen, a strobe light source for heating the surface of the junction of the test specimen, and an infrared thermograph capable of measuring temporal variation of the surface temperature of the junction of the test specimen. Preferably, the stage has a heat sink to which the test specimen can be mounted for promoting temperature variation, that is, cooling, of the heated test specimen.
申请公布号 US2008013594(A1) 申请公布日期 2008.01.17
申请号 US20060814930 申请日期 2006.02.02
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 KAWATE KOHICHIRO
分类号 G01N25/00 主分类号 G01N25/00
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