| 摘要 |
<p>In an electronic device, electronic components (12, 13) and the like are mounted on a base substrate (11). A part of the circumferences of the electronic components (12, 13) overlap a part of the end of the base substrate (11). Thus, peeling of the electronic components (12, 13) and the like and breakage of the base substrate (11) due to a force (F), which is applied on a portion surrounding the electronic components (12, 13) and the like on the base substrate (11) and warps such portion, can be suppressed.</p> |
