| 摘要 |
A wafer and a semiconductor device testing method are provided to use a common probe card in spite of difference of models of a product, thereby reducing a cost. In a wafer, a plurality of chip regions(2) in each of which a semiconductor device is manufactured are partitioned by scribe lines(8). The wafer includes at least three pads(10A,10B,10C). The at least three pads are installed in the scribe line adjacent to the chip region and in contact with contact pins of a probe card. The three pads includes a power pad(10A), a grounding pad(10B), and a switching pad(10C). The power pad is connected to a power potential portion inside the chip region. The grounding pad is connected to a ground potential portion inside the chip region. The switching pad is connected to a semiconductor device inside the chip region and switches an operating state of the semiconductor device between a normal operating state and a standby state.
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