| 摘要 |
A substrate treating apparatus of a single substrate type and a substrate treating method using the same are provided to prevent exposure of a treating surface of a substrate to external environment and to suppress generation of watermarks on the surface of a wafer. A housing(110) provides a space for cleaning and drying a substrate. A supporting member(120) is formed to support and rotate the substrate in the inside of the housing. A nozzle part(310) supplies chemicals to a treating surface of the substrate which is supported by the supporting member. A protection cover includes a plate having a bottom surface facing the treating surface and injection holes for injecting a cleaning fluid to the treating surface. A plurality of collection barrels are installed between the housing and the supporting member in order to collect one of the chemicals and the cleaning fluid. A control unit(400) controls the height of the protection cover in order to form a liquid film for blocking the external air on the treating surface of the substrate.
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