| 摘要 |
The invention provides a wafer dryer including a wafer bath vessel for supporting at least one wafer having an exposed surface to be dried. A tub has a drying liquid spray device and a non-reactive carrier gas spray device opposing the drying liquid spray device. The spray device emits a stream of pressurized drying liquid that converges with a stream of opposed pressurized non-reactive carrier gas emitted by the spray device of pressurized non-reactive gas to produce a drying liquid fog. The tub vents the drying liquid fog into the wafer bath vessel with the drying liquid fog drying the wafer. A method for drying a wafer includes emitting a stream of pressurized drying liquid and a stream of pressurized non-reactive carrier gas opposed to said drying liquid stream to produce a drying liquid fog.
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