| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the increase of thickness owing to the mounting of a heat sink, and to uniformly emit heat generated from each of stack semiconductor chips to the outside. <P>SOLUTION: This stack package includes: a base substrate having connection pads on an upper surface thereof and ball lands on a lower surface thereof; at least two semiconductor chips stacked by intervening a spacer on the base substrate, and defined with through-holes for electrical connection on sections corresponding to the connection pads; a pair of heat sinks formed such that they contact the side surfaces of the stacked semiconductor chips and extend in a direction perpendicular to the base substrate; and outside connection terminals attached to the ball lands located on the lower surface of the base substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
