| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober which suppresses the thermal deformation of X- and Y-axis movable stages at heating/cooling of a wafer chuck to ensure a high travel accuracy of these movable stages. SOLUTION: The prober having a wafer chuck 16 containing a heating/cooling member 5 comprises heating/cooling members 51, 52 provided on at least one of the X- and Y-axis movable stages 14, 13 so as to operate synchronously with the motion of the heating/cooling member 5 of the chuck 16, and a buffer mechanism 6 provided at a slider for sliding the Y-axis movable stage 13 on a guide rail 1 and a slider for sliding the X-axis movable stage 14 on a guide rail 2. It actuates the heating/cooling members 51, 52 to operate with the performance of the heating/cooling member 5 of the chuck 16 and the buffer mechanism to absorb the displacement of the movable stages 14, 13 to ensure the travel accuracy of these movable stages 14, 13. COPYRIGHT: (C)2008,JPO&INPIT |
