| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module which can reduce stubs harmful upon formation of a high speed circuit. SOLUTION: A wiring circuit board 5 comprises a first circuit 51 provided on a surface 50a of a substrate 50 and including a first electrode pad 511a, a second circuit 52 provided on the surface 50a of the substrate 50 and including a second electrode pad 521a electrically isolated from the first electrode pad 511a, a third circuit 53 provided on a rear surface 50b of the substrate 50 and including a third electrode pad 531a, a lead electrode pad 511b provided at a position associated with the first electrode pad 511a in the rear surface 50b of the substrate 50 and electrically isolated from the third electrode pad, a through-hole 54 for use to electrically connect the first electrode pad with a connecting electrode pad, and a jumper chip 55 mounted on the front surface 50a of the substrate 50 or on the rear surface 50b thereof for connecting the first circuit and the second circuit or the first circuit and the third circuit. COPYRIGHT: (C)2008,JPO&INPIT
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