发明名称 WIRING BOARD, MULTIPLE PATTERNING WIRING BOARD, PACKAGE FOR HOUSING ELECTRONIC PART, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of obtaining a package for housing an electronic part inhibiting the occurrence of a crack in a wiring-board region, and having an excellent reliability, and to provide a multiple patterning wiring board. SOLUTION: The wiring board has the wiring-board region 102 formed at the central section of a mother board 101, an outer-peripheral region 103 placed outside the wiring-board region 102 and a division predetermined line 104 formed between the wiring-board region 102 and the outer-peripheral region 103. The wiring board further has one main-surface side dummy trench 105 and the other main-surface side dummy trench 105 formed to each of one main surface, and the other main surface of the mother board 101 along the division predetermined line 104 in the outer-peripheral region 103. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008010560(A) 申请公布日期 2008.01.17
申请号 JP20060178211 申请日期 2006.06.28
申请人 KYOCERA CORP 发明人 FURUMOTO YUICHI
分类号 H01L23/13;H05K1/02 主分类号 H01L23/13
代理机构 代理人
主权项
地址