摘要 |
PROBLEM TO BE SOLVED: To retard intrusion of flux applied in soldering process into an electronic component mounted on a main circuit board. SOLUTION: A dividing portion 2 is formed on the boundary of a main circuit board 1A and a dummy board 1B. The dividing portion 2 consists of an elongated slit 10, and a perforation 12 located between the slits 10. The perforation 12 is formed such that its internal tangent S is located on the inside of a reference line P connecting the inner edge of each slit 10. A connector terminal 3 is mounted on the main circuit board 1A continuously to and in flush with the outer edge thereof while covering the perforation 12. Consequently, flux is hard to enter the connector terminal 3 from the perforation 12 when soldering is performed. COPYRIGHT: (C)2008,JPO&INPIT
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