| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition for portable electronic equipment, excellent in mechanical strength, thin-wall moldability and warpage resistance. SOLUTION: The polyamide resin composition comprises a total of 100 wt.% of (A) 30-80 wt.% of a polyamide MP and (B) 20-70 wt.% of a second polyamide resin 245°C or higher in melting point and also contains filler(C). In this resin composition, the filler C comprises a fibrous filler(C1) as an optional component and a filler(C2) as the essential component in the weight ratio C1/C2 of (0:10) to (9:1), wherein the content of the filler C is 30-250 pts.wt. based on a total 100 pts.wt. of the polyamide MP(A) and the second polyamide resin(B), and the polyamide MP(A) is such a polyamide resin as to be obtained by polycondensation reaction between a mixed diamine comprising 90-50 mol% of m-xylylenediamine and 10-50 mol% of p-xylylenediamine and anα,ω-straight-chain aliphatic dibasic acid and/or an aromatic dibasic acid. COPYRIGHT: (C)2008,JPO&INPIT
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