发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLASHLESS LEADS |
摘要 |
An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
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申请公布号 |
US2008012100(A1) |
申请公布日期 |
2008.01.17 |
申请号 |
US20070670899 |
申请日期 |
2007.02.02 |
申请人 |
PUNZALAN JEFFREY D;BATHAN HENRY D;SHIM IL KWON;CAMACHO ZIGMUND RAMIREZ |
发明人 |
PUNZALAN JEFFREY D.;BATHAN HENRY D.;SHIM IL KWON;CAMACHO ZIGMUND RAMIREZ |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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