发明名称 METHOD FOR MANUFACTURING OPTICAL DEVICE, AND OPTICAL DEVICE WAFER
摘要 A method for manufacturing an optical device includes the steps of: forming a first multilayer film, including forming a first mirror above a substrate, forming an active layer above the first mirror, forming a second mirror above the active layer, forming a semiconductor layer on the second mirror, and forming a sacrificial layer on the semiconductor layer; conducting a first examination step of conducting a reflectance examination on the first multilayer film; forming a second multilayer film by removing the sacrificial layer from the first multilayer film; conducting a second examination step of conducting a reflection coefficient examination on the second multilayer film; and patterning the second multilayer film to form a surface-emitting laser section having the first mirror, the active layer and the second mirror, and a diode section having the semiconductor layer, wherein the sacrificial layer is formed to have an optical film thickness of an odd multiple of lambda/4, where lambda is a design wavelength of light emitted by the surface-emitting laser section.
申请公布号 US2008013575(A1) 申请公布日期 2008.01.17
申请号 US20070769234 申请日期 2007.06.27
申请人 SEIKO EPSON CORPORATION 发明人 IMAI YASUTAKA
分类号 H01S5/028;B29D11/00 主分类号 H01S5/028
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