| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain an electronic device aiming at improvement in mounting efficiency. <P>SOLUTION: The electronic device 1 comprises: a first heating element 12 mounted in a first surface 11a of a circuit board 11, a first member 16 for heat dissipation thermally connected to the first heating element 12, a first support medium 14 mounted in the circuit board 11 using an attachment hole 21 while supporting the first member 16 for heat dissipation, a second heating element 13 mounted in a second surface 11b so that a part may overlap with the first heating element 12 along the thickness direction of the circuit board 11, a supporting second member 17 for heat dissipation thermally connected to the second heating element 13, and a second support medium 15 mounted in the circuit board 11 by utilizing the attachment hole 21 that the first support medium 14 uses together while supporting the second member 17 for heat dissipation. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
