| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device such as a wafer level CSP, etc. which prevents cut tips from flying at dicing of a semiconductor wafer to avoid troubles such as break and tipping of the dicing blade, and eliminates the need of complicating the dicing process. SOLUTION: After forming a linear groove 3 along a circumference on the outer periphery 2 of the backside of a semiconductor wafer 1; a dicing tape is pasted to the wafer backside, and the wafer is diced with a dicing blade. The adhesive of the dicing tape penetrates in the linear groove to reinforce the adhesion force. COPYRIGHT: (C)2008,JPO&INPIT |
